02012nas a2200229   4500008004100000022001400041245010000055210006900155260000700224300001100231490000700242520136200249653000701611653000701618100001801625700002301643700002101666700002001687700001701707700002001724856003801744       2025                        eng d  a2166-274600aCompact vacuum setup for laser induced plasma etching with optical emission spectrum monitoring0 aCompact vacuum setup for laser induced plasma etching with optic  c04  a0342020 v433 a<p>Reactive ion etching and reactive ion beam etching are widely used processes in the semiconductor industry but face challenges due to their high cost, energy demands, and maintenance complexity. Femtosecond laser micromachining has emerged as a versatile and precise method for microfabrication, but it often results in suboptimal surface quality, which requires postprocessing. Laser-induced plasma etching (LIPE) presents a promising solution, achieving low surface roughness and efficient material removal rates. Here, we investigate the LIPE process by utilizing a femtosecond laser setup with optimized optical components and a custom-designed compact vacuum chamber, enabling precise control and monitoring of the reactive gas environment for plasma generation and etching. The effects of numerical aperture, working distance, and laser energy thresholds on plasma ignition and plume formation were examined. Preliminary results demonstrate plasma ignition in air and SF6 gas with laser pulse energy thresholds between 15 and 20 μJ using a 10× magnification microscope objective. The spectral analysis of the plasma generated in the SF6 gas provides insights into plasma dynamics and enables real-time process monitoring. This work establishes foundational parameters for optimizing LIPE setups and advancing precision etching applications.</p>10aAF10aMF1 aSilhan, Lukas1 aArregi, Jon, Ander1 aPlichta, Tomáš1 aVaculik, Ondrej1 aNovotny, Jan1 aŠerý, Mojmír  uhttps://doi.org/10.1116/6.0004296